The trend of PCB technology upgrade is obvious, and high-density interconnection has become the mainstream

HDI technology is leading the transformation of the PCB industry, achieving higher density layout and finer circuits, meeting the growing demands of consumer electronics and automotive electronics, and promoting enterprise innovation and upgrading.

Against the backdrop of the rapid development of the global electronic information industry at present, the trend of technological upgrading in the printed circuit board (PCB) industry is becoming increasingly obvious. Among them, high-density interconnection (HDI) technology, with its excellent performance and broad application prospects, is gradually becoming the mainstream direction of industry development.

HDI technology is an advanced PCB manufacturing technology that can achieve higher density circuit layout and finer circuit width, thereby enhancing the performance and reliability of PCB products. With the continuous improvement of performance and quality requirements for PCB products in fields such as consumer electronics and automotive electronics, the application scope of HDI technology is constantly expanding.

Meanwhile, the development of HDI technology has also promoted technological innovation and industrial upgrading in the PCB industry. Enterprises need to continuously invest in research and development efforts, improve production processes and technological levels, in order to adapt to the changes in market demands and the intensification of industry competition.

It can be foreseen that with the continuous maturation of HDI technology and the further expansion of its application fields, the PCB industry will witness more technological breakthroughs and market opportunities. At the same time, enterprises also need to keep up with the pace of technological upgrading, constantly enhance their own competitiveness and innovation capabilities, so as to remain invincible in the fierce market competition.