Principles of printed circuit boards

‌ A printed circuit board (PCB) is an electronic component that is electrically connected between electronic components by forming point-to-point connections and printed elements on an insulating substrate according to a predetermined design. ‌ The main function of PCB is to provide mechanical support for various components in the circuit, so that various electronic components form the electrical connection of the predetermined circuit, and play the role of relay transmission. In addition, the PCB also marks the installed components by marking symbols, which is easy to insert, check and debug.

‌ ‌ The manufacturing process for a printed circuit board consists of the following major steps:

※‌ Design ‌ : Design the PCB layout and circuit according to the circuit requirements.

※ Making the substrate ‌ : Select a suitable insulating material as the substrate, such as copper clad plate (CCL).

‌※ Line making ‌ : Transfer the designed line pattern to the substrate through the process of exposure and development.

※‌ Electroplating ‌ : Electroplating copper or other conductive materials on the circuit pattern to form a conductive circuit.

‌ ※ Assembly ‌ : Install the electronic components on the PCB and fix them by welding and other means.

‌ ※ Detection and testing ‌ : Perform functional tests on the PCB to ensure that each component works normally.

‌ Printed circuit boards are used in a wide range of applications, including:

※‌ Communication equipment ‌ : such as mobile phones, routers, etc.

‌※ Consumer electronics ‌ : such as TV, audio, etc.

‌※ Automotive electronics ‌ : such as vehicle entertainment system, instrument panel, etc.

‌※ Industrial control ‌ : such as automation equipment, robots, etc.

‌※ Medical equipment ‌ : such as monitors, ultrasonic equipment, etc.

‌※ Aerospace ‌, such as navigation systems, communication equipment.

With the increase in the complexity of electronic equipment, the design and manufacturing technology of PCB is also improving, and high-density and high performance have become the main development direction.