Chen fei Electronic have been providing a high quality & cost effective PCB assembly
one stop solution . We have 12 years PCB&PCBA OEM/ODM experience.Our full turnkey service includes Printed Circuit Board Design & Layout, PCB production, Components sourcing, PCB assembly, Conformal Coating,Software Development, Enclosure Design & Development, Functional Testing and Mechanical Assembly/ Box Build.
Whether you require electronic assembly, hardware or embedded software design, PCB supply, PCB layout, pre-compliance EMC testing or any combination of the above, Our PCB produce
have passed the certificates of international quality system as ISO9001, ISO14001, TS16949, UL certified and all of products following the IPC and ROHS standards.It’s available to finish the 2 layers PCB within 48 hours and multilayer PCB within 3-4 days.
A blend of rigid and flex emphasizing the best of both constructions, adding complimenting capabilities that neither possess alone. In its most typical configuration, the rigid-flex is as a series of rigid PCBs joined by integrated flex circuits (with emphasis on the high percentage of rigid area content). There are many excellent possibilities for circuits designed primarily as a flex circuit with the addition of integrated rigid areas. The rigid areas provide excellent hard mount points for components, connectors and chassis while flex areas offer dynamic flexing, flex to fit, and component mounting poised to take advantage of these low mass and vibration resistant zones. This blending leads to creative solutions for your most demanding applications.
Multilayer flex circuits offer exceptional performance and reliability in situations where the circuit is exposed to excessive vibration or shock combined with frequent bending or folding. Multilayer technology allows high circuit density connections to be achieved in applications where one or two layers of conductors could not meet the required circuit packaging requirements. Additionally, multilayer flex circuits provide increased functionality with a smaller footprint.